1 switching diode features silicon epitaxial planar diode smd chip pattern, available in various dimension included 1206 & 0805 leadfree and rohs compliance components for small signal switching and operating ambient temperature less than 55 o c and voltage withstand less than 60v; not suitable for ac switching input as rectified circuit and high reverse voltage location. cd4148wtn is suitable for those application mechanical characteristics size: 0603 weight: approx. 4mg marking: cathode terminal dimensions dimension/mm 0603 l 1.550.1 w 0.800.1 t 0.650.1 c 0.350.1 thermal characteristics 1) parameter at t amb =25 o c 1) symbol value unit 200 mw forward power dissipation power derating above 25 o c p tot 1.6 mw/ o c junction temperature t j 150 o c thermal resistance junction to ambient air r ja 375 o c/w operating& storage temperature range t stg -55 to 150 o c 1) valid provided that electrodes are kept at ambient temperature. c d 4 148 w t p
c3 2 c d 4 1 4 8 w t p maximum rating 1) parameter at t amb =25 o c 1) symbol value unit repetitive peak reverse voltage v rrm 75 v average rectified current sin half wave rectification with resistive load i f(av) 100 ma repetitive peak forward current at t amb =25c i frm 200 ma non-repetitive surge forward current at t<1s and t j =25 o c 400 ma at t Q 8.3ms and t j =25 o c i fsm 800 ma 1) valid provided that electrodes are kept at ambient temperature. electrical characteristics 1) parameter at t amb =25 o c 1) symbol value unit forward voltage at i f =10ma 1.0 max v at i f =100ma v f 1.25 max v leakage current at v r =20v 0.025 max ua leakage current at v r =75v i r 5 max ua capacitance at v r =0v, f=1mhz c tot 4 max pf reverse recovery time at i f =i r =10ma,r l = 100 t rr 4 max ns 1) valid provided that electrodes are kept at ambient temperature. typical characteristics c3 figure 1. forward characteristic s3 figure 2. power de-rating s3 s3 s3 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc ptot-admissible power dissipation/ mw . 3
3 c d 4 1 4 8 w t p figure 3. forward current d e- rating figure 4. reverse voltage de-rating 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc if/ ma . . 0 50 100 150 200 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc vr/ v . . test characteristics test item test condition requirement solderability sn bath at 2455 o c for 20.5s >95% area tin covered resistance to soldering heat sn bath at 2605 o c for 102s v f ,v r & i r within spec; no mechanical damage humidity steady state at 85 o c 85%rh for 168hrs v f ,v r & i r within spec continue forward operating life at 25 o c i f =1.1i f for 1000hrs v f ,v r & i r within spec thermal shock -55 5 o c/5min to 1505 o c/5min for 10cycles v f ,v r & i r within spec bending strength bending up to 2mm for 1cycle v f ,v r & i r within spec; no mechanical damage
4 c d 4 1 4 8 w t p applications function: suit for small signal switching application typical application circuit: typical product field: general application except high reverse voltage location soldering condition: soldering condition & caution recommended soldering condition (refer to ipc/jedec j-std-020d 4-1&5.2) recommended profile condition sn-pb soldering leadfree soldering wave soldering ramp-up rate (from pre-heat stage) <3 o c/s <3 o c/s t<150 o c pre-heat temperature & time 100-150 o c 60-120s 150-200 o c 60-120s 100-150 o c 60-120s soldering temperature & time 183 o c 60-150s 217 o c 60-150s 2605 o c 52s peak temperature 2305 o c <260 o c 2455 o c <260 o c 2605 o c time within 5 o c of peak temperature 10-20s 20-30s - ramp-down rate <6 o c/s <6 o c/s <6 o c/s time 25 o c to peak temperature <6min <8min - manual soldering: approx. 350 o c for 3s, avoid solder iron tip direct touch the components body
5 c d 4 1 4 8 w t p recommended soldering profile fig1: reflow soldering profile for lead-free solder (snagcu) fig2: wave soldering profile *1. the recommended profiles are referring to ipc/jedec j-std-020d & iec-60068-2-58 *2. chip diodes are able to stand maximum soldering temperature up to 260 o c max for 10s, and the soldering cycles with max 3 times, referring to iec-60068-2-58 t/s t / o c t/s t / o c
6 c d 4 1 4 8 w t p recommended soldering footprint: reflow/wave soldering dimension/ mm product size a b c d 0603 1.8-2.6 0.8 0.5-0.9 0.8-1.0 storage condition: product termination solderability can degrade due to high temperature and humidity or chemical environment. storage condition must be in an ambient temperature of <40 o c and ambient humidity of <75%rh, and free from chemical. environmental characteristics hazardous substance or element/ppm pb cd hg cr 6+ pbb pbde product <1000 <100 <1000 <1000 <1000 <1000 halogen substance/ ppm f cl br i total product <900 <900 <900 <900 <1500 packing method quality/reel reel size tape product 5,000pcs 7 paper disclaimers these products are not designed for use in applications where any failure or malfunction may resulted in personal injury, death or severe property or environmental damage such as medical, military, aircraft, space or life support equipments.
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